Stress relaxation during thermal cycling in metal/polyimide layered films

DOI PDF 被引用文献3件
  • S. T. Chen
    IBM T. J. Watson Research Center, Yorktown Heights, New York 10598
  • C. H. Yang
    IBM T. J. Watson Research Center, Yorktown Heights, New York 10598
  • F. Faupel
    IBM T. J. Watson Research Center, Yorktown Heights, New York 10598
  • P. S. Ho
    IBM T. J. Watson Research Center, Yorktown Heights, New York 10598

書誌事項

公開日
1988-12-15
DOI
  • 10.1063/1.341999
公開者
AIP Publishing

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説明

<jats:p>The stress relaxation behavior during thermal cycling of metal/quartz and metal/polyimide/quartz layered structures has been investigated using a cantilever bending beam technique. The metals chosen for this study include Cu and Cr, two materials with contrasting mechanical and interfacial bonding properties. A finite element analysis, as well as an analytical calculation, has been carried out to deduce the stress distribution in the layered structures. Results indicate that the extent of stress relaxation strongly depends on the intrinsic mechanical property of the metal film with significantly higher stresses residing in the Cr film than in the Cu film. The interfacial polyimide layer has been found to serve as an effective buffering layer to reduce the residual stress in metal films. Observations from transmission electron microscopy suggest that the stress is partially released through the deformation of the polyimide near the metal/polyimide interface.</jats:p>

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