Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

詳細情報 詳細情報について

• CRID

  1361699994042094080

• DOI

  10.1007/s11664-000-0010-y

• ISSN

  1543186X

  03615235

• Web Site

  http://link.springer.com/content/pdf/10.1007/s11664-000-0010-y.pdf

  http://link.springer.com/article/10.1007/s11664-000-0010-y/fulltext.html

  http://link.springer.com/content/pdf/10.1007/s11664-000-0010-y

• データソース種別

  • Crossref