Uniform Ti-doped Sb2Te3 materials for high-speed phase change memory applications

  • Min Zhu
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Liangcai Wu
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Feng Rao
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Zhitang Song
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Kun Ren
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Xinglong Ji
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Sannian Song
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Dongning Yao
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China
  • Songlin Feng
    State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences 1 , 200050 Shanghai, China

書誌事項

公開日
2014-02-03
DOI
  • 10.1063/1.4863430
公開者
AIP Publishing

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説明

<jats:p>Compared with pure Sb2Te3, Ti0.32Sb2Te3 (TST) phase change material has larger resistance ratio, higher crystallization temperature and better thermal stability. The sharp decrease in mobility is responsible for the increasing amorphous and crystalline sheet resistance. The uniform crystalline structure of TST film is very benefit for the endurance characteristic. The Set and Reset operation voltages for TST-based phase change memory device are much lower than those of conventional Ge2Sb2Te5-based one. Remarkably, the device presents extremely rapid Set operation speed (∼6 ns). Furthermore, up to 1 × 106 programming cycles are obtained with stable Set and Reset resistances.</jats:p>

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