Hierarchical Three-Dimensional Layer-by-Layer Assembly of Carbon Nanotube Wafers for Integrated Nanoelectronic Devices
-
- Kenji Hata
- Japan Science and Technology Agency (JST), Kawaguchi 332-0012, Japan
書誌事項
- 公開日
- 2012-08-17
- DOI
-
- 10.1021/nl3016472
- 公開者
- American Chemical Society (ACS)
この論文をさがす
説明
We report a general approach to overcome the enormous obstacle of the integration of CNTs into devices by bonding single-walled carbon nanotubes (SWNTs) films to arbitrary substrates and transferring them into densified and lithographically processable "CNT wafers". Our approach allows hierarchical layer-by-layer assembly of SWNTs into organized three-dimensional structures, for example, bidirectional islands, crossbar arrays with and without contacts on Si, and flexible substrates. These organized SWNT structures can be integrated with low-power resistive random-access memory.
収録刊行物
-
- Nano Letters
-
Nano Letters 12 (9), 4540-4545, 2012-08-17
American Chemical Society (ACS)