Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip–chip interconnection
書誌事項
- 公開日
- 2006-01
- 権利情報
-
- https://www.elsevier.com/tdm/userlicense/1.0/
- DOI
-
- 10.1016/j.mseb.2005.08.114
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
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- Materials Science and Engineering: B
-
Materials Science and Engineering: B 126 (1), 59-65, 2006-01
Elsevier BV