Plasma-Induced Decomposition of Copper Complex Ink for the Formation of Highly Conductive Copper Tracks on Heat-Sensitive Substrates
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- Yousef Farraj
- Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
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- Ariel Smooha
- Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
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- Alexander Kamyshny
- Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
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- Shlomo Magdassi
- Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
書誌事項
- 公開日
- 2017-03-02
- DOI
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- 10.1021/acsami.6b14462
- 公開者
- American Chemical Society (ACS)
この論文をさがす
収録刊行物
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- ACS Applied Materials & Interfaces
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ACS Applied Materials & Interfaces 9 (10), 8766-8773, 2017-03-02
American Chemical Society (ACS)