Sn–Zn low temperature solder

DOI DOI PDF Web Site Web Site 被引用文献3件

書誌事項

公開日
2006-09-01
権利情報
  • http://www.springer.com/tdm
DOI
  • 10.1007/s10854-006-9018-2
  • 10.1007/978-0-387-48433-4_7
公開者
Springer Science and Business Media LLC

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説明

Low temperature soldering is one of the key technologies before the accomplishment of total lead-free conversion in electronics industries. While Sn-Zn eutectic alloy has excellent properties as low temperature solder, it has some drawbacks. Damage by heat exposure and corrosion in humidity are two of the main concerns. Zn has an important role in chemical properties. The material physical properties, wetting, chemical stabilities and various reliabilities have been well understood on this alloy system through the numerous past works. The understanding of both materials and processing aspects enables one to manufacture sound electronic products without any serious problems. The basic properties and the current understandings on the limit of the application of this solder are reviewed in this paper.

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