書誌事項
- 公開日
- 2009-01
- 権利情報
-
- https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
- DOI
-
- 10.1109/jproc.2008.2007462
- 公開者
- Institute of Electrical and Electronics Engineers (IEEE)
この論文をさがす
説明
Recently, the development of three-dimensional large-scale integration (3D-LSI) has been accelerated. Its stage has changed from the research level or limited production level to the investigation level with a view to mass production. The 3D-LSI using through-silicon via (TSV) has the simplest structure and is expected to realize a high-performance, high-functionality, and high-density LSI cube. This paper describes the current and future 3D-LSI technologies with TSV.
収録刊行物
-
- Proceedings of the IEEE
-
Proceedings of the IEEE 97 (1), 43-48, 2009-01
Institute of Electrical and Electronics Engineers (IEEE)