Thermal conductivity enhancement of copper–diamond composites by sintering with chromium additive

DOI PDF Web Site Web Site 被引用文献3件

書誌事項

公開日: 2014-01-30

権利情報

http://creativecommons.org/licenses/by/2.0

DOI

10.1007/s10973-013-3604-3

公開者: Springer Science and Business Media LLC

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CiNii Books

収録刊行物

Journal of Thermal Analysis and Calorimetry

Journal of Thermal Analysis and Calorimetry 116 (2), 881-885, 2014-01-30

Springer Science and Business Media LLC

被引用文献 (3)*注記

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詳細情報詳細情報について

CRID

1362262943319227392
DOI

10.1007/s10973-013-3604-3
ISSN

15882926

13886150
Web Site

http://link.springer.com/content/pdf/10.1007/s10973-013-3604-3.pdf

http://link.springer.com/article/10.1007/s10973-013-3604-3/fulltext.html

http://link.springer.com/content/pdf/10.1007/s10973-013-3604-3
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