Manufacturing concerns of the electronic industry regarding intermetallic compound formation during the soldering stage
書誌事項
- DOI
-
- 10.1109/iemt.1996.559744
- 公開者
- IEEE
収録刊行物
-
- Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium
-
Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium 282-292,
IEEE
