Deep-ultraviolet interferometric lithography as a tool for assessment of chemically amplified photoresist performance

  • W. Hinsberg
    IBM Almaden Research Center, San Jose, California 95120
  • F. A. Houle
    IBM Almaden Research Center, San Jose, California 95120
  • J. Hoffnagle
    IBM Almaden Research Center, San Jose, California 95120
  • M. Sanchez
    IBM Almaden Research Center, San Jose, California 95120
  • G. Wallraff
    IBM Almaden Research Center, San Jose, California 95120
  • M. Morrison
    IBM Almaden Research Center, San Jose, California 95120
  • S. Frank
    IBM Almaden Research Center, San Jose, California 95120

書誌事項

公開日
1998-11-01
DOI
  • 10.1116/1.590392
公開者
American Vacuum Society

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説明

<jats:p>The precise control of the exposure step provided by interferometric photolithography facilitates studies of chemically amplified resist physics, chemistry, and functional properties that are difficult using more conventional exposure techniques. We describe here the design and operating characteristics of a deep-ultraviolet interferometric lithography tool designed specifically for the study of high resolution chemically amplified resists. We provide an example of its use to evaluate resist response to controlled variations in aerial image contrast.</jats:p>

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