Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
書誌事項
- 公開日
- 2010-07
- 権利情報
-
- https://www.elsevier.com/tdm/userlicense/1.0/
- DOI
-
- 10.1016/j.pmatsci.2010.01.001
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
-
- Progress in Materials Science
-
Progress in Materials Science 55 (5), 428-475, 2010-07
Elsevier BV
