Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device

詳細情報 詳細情報について

• CRID

  1363107368485454208

• DOI

  10.1109/tdmr.2017.2766692

• ISSN

  15582574

  15304388

• Web Site

  http://xplorestaging.ieee.org/ielx7/7298/8169690/08085168.pdf?arnumber=8085168

• データソース種別

  • Crossref