Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock
書誌事項
- 公開日
- 2018-01
- 権利情報
-
- https://www.elsevier.com/tdm/userlicense/1.0/
- https://www.elsevier.com/legal/tdmrep-license
- DOI
-
- 10.1016/j.msea.2017.10.007
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
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- Materials Science and Engineering: A
-
Materials Science and Engineering: A 709 125-133, 2018-01
Elsevier BV
