Efficient on-chip hotspot removal combined solution of thermoelectric cooler and mini-channel heat sink
書誌事項
- 公開日
- 2016-05
- 権利情報
-
- https://www.elsevier.com/tdm/userlicense/1.0/
- http://www.elsevier.com/open-access/userlicense/1.0/
- https://doi.org/10.15223/policy-017
- https://doi.org/10.15223/policy-037
- https://doi.org/10.15223/policy-012
- https://doi.org/10.15223/policy-029
- https://doi.org/10.15223/policy-004
- DOI
-
- 10.1016/j.applthermaleng.2016.01.131
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
-
- Applied Thermal Engineering
-
Applied Thermal Engineering 100 170-178, 2016-05
Elsevier BV