Tensile strength of electrodeposited nanocrystalline Ni–W alloys with finely dispersed micrometer-sized array through-holes

DOI Web Site Web Site 被引用文献6件

書誌事項

公開日
2007-03
権利情報
  • https://www.elsevier.com/tdm/userlicense/1.0/
DOI
  • 10.1016/j.msea.2006.02.410
公開者
Elsevier BV

この論文をさがす

説明

Abstract Electrodeposited nanocrystalline Ni–W alloys with finely dispersed micrometer-sized array through-holes having diameters between 20 μm and 50 μm with a regular interval of 100 μm have been prepared by using UV (ultraviolet light)-lithographic techniques. In the case of monolithic nanocrystalline Ni–16 at.% W alloys with a grain diameter of 10–20 nm, the nominal tensile strength and the total elongation at fracture were attained at 1700 MPa and about 1%, respectively. With finely dispersed array through-holes having a diameter of 30 μm, the tensile strength and the total elongation at fracture increased up to about 2200 MPa and 1.2%, respectively. This may be due to the multiplication of highly localized yielding beginning at the finely dispersed array through-holes that can moderate the propagation of individual shear bands and cracks effectively.

収録刊行物

被引用文献 (6)*注記

もっと見る

詳細情報 詳細情報について

問題の指摘

ページトップへ