Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes

DOI Web Site Web Site 2 Citations

Bibliographic Information

Published
2002-10
Rights Information
  • https://www.elsevier.com/tdm/userlicense/1.0/
DOI
  • 10.1016/s0167-9317(02)00815-8
Publisher
Elsevier BV

Search this article

Journal

Citations (2)*help

See more

Report a problem

Back to top