Corrosion of Silicon Nitride Ceramics in Aqueous Hydrogen Chloride Solutions

DOI DOI Web Site Web Site 被引用文献3件

書誌事項

公開日
1988-12
権利情報
  • http://onlinelibrary.wiley.com/termsAndConditions#vor
DOI
  • 10.1111/j.1151-2916.1988.tb05794.x
  • 10.1002/chin.198909021
公開者
Wiley

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説明

<jats:p> The leaching behavior of pressureless sintered and hotpressed Si <jats:sub>3</jats:sub> N <jats:sub>4</jats:sub> containing Y <jats:sub>2</jats:sub> O <jats:sub>3</jats:sub> , Al <jats:sub>2</jats:sub> O <jats:sub>3</jats:sub> , and AlN and hot isostatically pressed Si <jats:sub>3</jats:sub> N <jats:sub>4</jats:sub> without additives was studied in 0.1 <jats:italic>M</jats:italic> to 10 <jats:italic>M</jats:italic> HCl aqueous solutions at 50° to 100°C. Y and Al ions contained in the grain‐boundary phase dissolved in HCl solutions, but dissolution of the Si ion from the matrix was negligible. The dissolution of Y and Al ions in HCl solutions was adequately described by a surface‐chemical‐reaction‐controlled, shrinking‐core model in <1 <jats:italic>M</jats:italic> HCl solutions and by a diffusion‐controlled, shrinking‐core model in >5 <jats:italic>M</jats:italic> HCl solutions. The rates of dissolution of both Y and Al ions decreased as the degree of crystallinity of the grain‐boundary phase increased. The fracture strength of the corroded samples linearly decreased with increasing degree of dissolution of soluble Y and Al ions. </jats:p>

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