書誌事項
- 公開日
- 1992
- DOI
-
- 10.1109/memsys.1992.187688
- 公開者
- IEEE
説明
Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metallization are noted. >
収録刊行物
-
- [1992] Proceedings IEEE Micro Electro Mechanical Systems
-
[1992] Proceedings IEEE Micro Electro Mechanical Systems 43-48, 1992
IEEE