Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

Hui-Wang Cui, Dong-Sheng Li, Qiong Fan, Hua-Xiang Lai

doi:10.1016/j.ijadhadh.2013.03.007

Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

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書誌事項

公開日: 2013-07

DOI

10.1016/j.ijadhadh.2013.03.007

公開者: Elsevier BV

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説明

Abstract In this study, we incorporated micro-silver flakes and nano-hexagonal boron nitride (BN) particles into a matrix resin to prepare electrically conductive adhesives (ECAs). The humid and thermal aging results under a constant relative humidity level of 85% at 85 °C revealed that the aged ECAs containing 3 wt% of nano-hexagonal BN particles had high reliability. The contact resistance was low and the shear strength high. Nano-hexagonal BN particles have a good effect on the reliability of ECAs that can be used to improve the properties of ECAs.