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- Steven Murray
- CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742
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- Craig Hillman
- CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742
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- Michael Pecht
- CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742
書誌事項
- 公開日
- 2004-09-01
- DOI
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- 10.1115/1.1773853
- 公開者
- ASME International
この論文をさがす
説明
<jats:p>One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms of environmental aging and fatigue. In this paper, the rate of aging of Kapton-E polyimide is quantified as a function of temperature and humidity exposure using peel and tensile tests. An accelerated test methodology that accounts for both aging and fatigue and that can be used to evaluate the resistance of electronic products to polyimide deadhesion is then proposed.</jats:p>
収録刊行物
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- Journal of Electronic Packaging
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Journal of Electronic Packaging 126 (3), 390-397, 2004-09-01
ASME International