Glass frit bonding: an universal technology for wafer level encapsulation and packaging

詳細情報 詳細情報について

• CRID

  1363670320231974528

• DOI

  10.1007/s00542-005-0022-x

• ISSN

  14321858

  09467076

• Web Site

  http://link.springer.com/content/pdf/10.1007/s00542-005-0022-x.pdf

  http://link.springer.com/article/10.1007/s00542-005-0022-x/fulltext.html

  http://link.springer.com/content/pdf/10.1007/s00542-005-0022-x

• データソース種別

  • Crossref