Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

DOI Web Site Web Site 被引用文献1件

収録刊行物

Microelectronics Reliability

Microelectronics Reliability 61 64-70, 2016-06

Elsevier BV

被引用文献 (1)*注記

もっと見る

詳細情報詳細情報について

CRID

1363670321212740992
DOI

10.1016/j.microrel.2015.12.041
ISSN

00262714
Web Site

https://api.elsevier.com/content/article/PII:S0026271415302882?httpAccept=text/xml

https://api.elsevier.com/content/article/PII:S0026271415302882?httpAccept=text/plain
データソース種別
- Crossref

書き出し

問題の指摘

ページトップへ