High performance integrated passive devices (ipds) on low cost through silicon interposer (LC-TSI)

DOI PDF 1 Citations

Journal

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) 2013-12

IEEE

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Details 詳細情報について

CRID

1363951794757964160
DOI

10.1109/eptc.2013.6745840
Web Site

http://xplorestaging.ieee.org/ielx7/6732180/6745670/06745840.pdf?arnumber=6745840
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