Outgassing Characteristics of Electroless Plated Epoxy Resin.
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- OTA Nobuhiko
- Corporate R & D Center, YASKAWA Electric Corporation
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- HAMAO Toshikazu
- Corporate R & D Center, YASKAWA Electric Corporation
Bibliographic Information
- Other Title
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- 無電解めっき処理エポキシ樹脂のガス放出特性
- ムデンカイメッキ ショリ エポキシ ジュシ ノ ガス ホウシュツ トクセイ
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Abstract
Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H2O from the surface and the inside of the epoxy resin.<BR>Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.
Journal
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- Shinku
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Shinku 45 (3), 142-144, 2002
The Vacuum Society of Japan
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Keywords
Details 詳細情報について
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- CRID
- 1390001204064731648
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- NII Article ID
- 10008202824
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- NII Book ID
- AN00119871
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- ISSN
- 18809413
- 05598516
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- NDL BIB ID
- 6144125
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed