銅-ヨウ素錯イオン浴からの銅メッキ

書誌事項

タイトル別名
  • Copper Plating from Copper-Iodide Complex Solutions

説明

Experiments were conducted to study whether copper-iodide complex solutions would be used as Strike Baths for steel. The suitable conditions of composition and operation of the bath were found to be Cu: 2-10g/l, KI: 160-400g/l, pH: 0-2, current density: 2-10Amp/dm2. Lustrous and adherent deposits were obtained under these conditions. However, the current efficiency was low as less than 24%, because of low copper content of the bath. Copper or nickel was available for the anode, but the copper anode was apt to be passive. Therefore, the ratio of area between anode and cathode had to be kept larger in order to decrease the anodic current densities.

収録刊行物

  • 金属表面技術

    金属表面技術 25 (1), 20-24, 1974

    一般社団法人 表面技術協会

詳細情報 詳細情報について

  • CRID
    1390001204114153984
  • NII論文ID
    130003994082
  • DOI
    10.4139/sfj1950.25.20
  • ISSN
    18843395
    00260614
  • 本文言語コード
    ja
  • データソース種別
    • JaLC
    • Crossref
    • CiNii Articles
  • 抄録ライセンスフラグ
    使用不可

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