電析法により作製したＣｕ／Ｎｉ‐Ｐ多層膜の構造と硬度に及ぼす熱処理の影響

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タイトル別名
  • Effect of Annealing on the Structure and the Hardness of Cu/Ni-P Multilayers Produced by Electrodeposition.
  • デンセキホウ ニ ヨリ サクセイ シタ Cu Ni P タソウ マク ノ コウゾウ ト コウド ニ オヨボス ネツ ショリ ノ エイキョウ

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Cu/Ni-P multilayers of 10μm thickness, consisting of pure Cu sublayers and Ni-P sublayers of which thicknesses are 50, 100, and 200nm, have been prepared on Cu substrates by electrodeposition from a single bath by using modulated (i.e. periodic pulse control) current density. Change in hardness of the multilayers with annealing temperature ranging between 473K and 873K has been examined and discussed in relation to the concomitant structural change. Cross-sectional views of the multilayers by a transmission electron microscope demonstrate that the layered structure disappears on annealing at temperatures above 673K. The hardness of the multilayers increases with an increase in annealing temperature, exhibiting the maximum value at 673K and decreases. The hardness behavior of the multilayers is discussed on the basis of dislocation inhibition at the interface in the multilayers.

収録刊行物

  • 表面技術

    表面技術 52 (11), 757-761, 2001

    一般社団法人 表面技術協会

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