Sn-Ag Alloy Electroplating for Use as Pb-Free Solder.
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- ARAI Susumu
- Prec. Tech. Res. Inst. of Nagano Prefecture
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- WATANABE Tohru
- Fac. of Tech., Tokyo Metropolitan Univ.
Bibliographic Information
- Other Title
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- Pbフリーはんだ用Sn‐Ag合金めっき
- Pb フリー ハンダヨウ Sn-Ag ゴウキン メッキ
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Abstract
We studied the effects of electrodeposition conditions on Sn-Ag alloy composition and current efficiency in Pb-free solder plating employing a new pyrophosphate-iodide bath. We also investigated the morphology, phase structure, thermal characteristics and solderability of electroplated Sn-Ag alloy films. Ag content in deposits decreased with increasing current density during both agitation and nonagitation, Sn-Ag electroplated films containing between 2.0 and 20.0 at% silver consisted of β-Sn and the ε phases, β-Sn phase orientation in electrodeposited Sn-Ag alloy films became random with increasing ε phase content. The melting point, i.e., the temperature at which melting first occurred, of electroplated Sn-Ag alloy films was 221°C. Wetting time of electroplated Sn-Ag alloy films became minimum at a near Sn-Ag eutectic composition and was not affected by thickness from 0.5 to 10μm.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 49 (1), 73-77, 1998
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204114461440
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- NII Article ID
- 10002108520
- 10008848885
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DyaK1cXpvVKgsw%3D%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL BIB ID
- 4367227
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed