Influence of the Oxide Film on the Solderability of Nickel Electrodeposits.

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  • ニッケルめっきのはんだ付け性におよぼす酸化皮膜の影響
  • ニッケル メッキ ノ ハンダズケセイ ニ オヨボス サンカ ヒマク ノ エイキ

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It was experimentally shown that when nickel oxide films were formed on nickel films electrodeposited by controlled potential technique, solderability declined with increasing quantity of electricity in anodic oxidation. Nickel films 1∼7μm in thickness were electrodeposited from a Watts bath. The real thickness of nickel oxide films was represented by the quantity of electricity in anodic oxidation because measurement by ellipsometry had a large error. Soldering to electrodeposited nickel films was virtually impossible in anodic oxidation at quantities over 15.5×10-3C cm-2. Solderability was not affected at quantities below 3.0×10-3C cm-2. After nickel electrodeposition, the nickel oxide films were dissolved by hydrogen forming by cathodic reduction at -1.40V vs. Ag/AgCl and solderability was raised.

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