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Influence of the Oxide Film on the Solderability of Nickel Electrodeposits.
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- WU Wen-Chang
- Toshin Ind. Co., Ltd.
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- CHIBA Atsushi
- Fac. of Eng., Yokohama National Univ.
Bibliographic Information
- Other Title
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- ニッケルめっきのはんだ付け性におよぼす酸化皮膜の影響
- ニッケル メッキ ノ ハンダズケセイ ニ オヨボス サンカ ヒマク ノ エイキ
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Description
It was experimentally shown that when nickel oxide films were formed on nickel films electrodeposited by controlled potential technique, solderability declined with increasing quantity of electricity in anodic oxidation. Nickel films 1∼7μm in thickness were electrodeposited from a Watts bath. The real thickness of nickel oxide films was represented by the quantity of electricity in anodic oxidation because measurement by ellipsometry had a large error. Soldering to electrodeposited nickel films was virtually impossible in anodic oxidation at quantities over 15.5×10-3C cm-2. Solderability was not affected at quantities below 3.0×10-3C cm-2. After nickel electrodeposition, the nickel oxide films were dissolved by hydrogen forming by cathodic reduction at -1.40V vs. Ag/AgCl and solderability was raised.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 45 (11), 1121-1125, 1994
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204114784128
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- NII Article ID
- 130001072070
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- NII Book ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 3907709
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- Crossref
- CiNii Articles
- OpenAIRE
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- Abstract License Flag
- Disallowed