流動層中でのニッケルのホウ化処理

書誌事項

タイトル別名
  • Boriding of Nickel in Fluidized Bed.
  • リュウドウソウ チュウ デ ノ ニッケル ノ ホウカ ショリ

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抄録

Bonding is useful in surface hardening nickel (Ni) in many surface treatments. Although Ni boronized by powder-pack bonding with amorphous boron and by gas bonding with BCl3 has been reported, few reports cover bonding in a fluidized bed. We analyzed the treated layer using X-ray diffraction (XRD), glancing incidence X-ray diffraction, glow discharge emission spectrometry (GDS), and electron probe microanalyzer (EPMA). High-temperature microhardness and friction and wear characteristics of boronized Ni were studied, with the following results:<br>(1) Bonding Ni at a high temperature over a long time in a fluidized bed showed flaking of the treated layer due to Ni siliconization.<br>(2) The Knoop hardness was 1300HK for the sample boronized 7.2ks at 1073K. The boride layer was about 25μm thick and consisted mainly of Ni2B and Ni3B.<br>(3) The high-temperature microhardness of boronized Ni is higher than that of untreated Ni below about 800K.<br>(4) Friction properties and wear resistance to SUJ2 and SUS304 were improved by Ni bonding.

収録刊行物

  • 表面技術

    表面技術 50 (3), 282-288, 1999

    一般社団法人 表面技術協会

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