Origins of Nodules in Electroless Nickel-Phosphorus Deposition.

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  • 無電解Ｎｉ‐Ｐめっき膜のノジュールの発生要因
  • ムデンカイ Ni P メッキ マク ノ ノジュール ノ ハッセイ ヨウイン

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Abstract

The origins of nodule formation in electroless nickel-phosphorus deposition were investigated. It was found that the pretreatment and plating conditions influenced the formation of nodules.<br>Nodules were observed in the fractographs of the depositions depending on changes in the surface morphology of the copper substrate when the plating baths included mono- or di- carboxylic acids. On the other hand, nodules were not observed in the fractographs of the depositions with plating baths that contained hydroxycarboxylic acids.<br>Nodules tended to be less likely to form when the deposition rate was relatively low and the phosphorus content of the deposition was high.

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