Electronics Packaging Using Plating Technology
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- MIURA Shuhei
- Graduate School of Engineering, Kanto Gakuin University
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- HONMA Hideo
- Faculty of Engineering, Kanto Gakuin University
Bibliographic Information
- Other Title
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- マイクロデバイス実装と表面技術 Ｉ エレクトロニクス実装とめっき技術
- エレクトロニクス ジッソウ ト メッキ ギジュツ
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Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 52 (5), 366-368, 2001
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204115589888
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- NII Article ID
- 10007481629
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD3MXltFSlt7o%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL BIB ID
- 5764539
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
