Plating Technologies for Electroplating Industries. Bump Process Technology for LSI Wafer.
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- HONMA Soichi
- Semiconductor Manufacturing Engineering Center, Toshiba Corp.
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- YOSHIOKA Junichiro
- Precision Machinery Group, Ebara Corp.
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- HIRUTA Yoichi
- Semiconductor Manufacturing Engineering Center, Toshiba Corp.
Bibliographic Information
- Other Title
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- エレクトロニクス産業におけるめっき技術 ウェハーバンプ形成技術
- ウェハーバンプ ケイセイ ギジュツ
Search this article
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 49 (12), 1244-1250, 1998
The Surface Finishing Society of Japan
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Keywords
Details 詳細情報について
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- CRID
- 1390001204115652224
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- NII Article ID
- 10002111158
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- NII Book ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 4624028
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
