Effect of Complexing Agents on Micro-pattern Formation Using Electroless NiB Plating.

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  • YOKOSHIMA Tokihiko
    School of Science and Eng., Kagami Memorial Lab. for Materials Science and Technology, Waseda Univ.
  • YUASA Hiroko
    School of Science, Japan Woman Univ.
  • KIM Man
    Material Processing Div., Korea Inst. of Machinery and Materials
  • OSAKA Tetsuya
    School of Science and Eng., Kagami Memorial Lab. for Materials Science and Technology, Waseda Univ.

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  • 無電解ＮｉＢめっきを用いたマイクロパターニングにおける錯化剤の影響
  • ムデンカイ NiBメッキ オ モチイタ マイクロパターニング ニ オケル サク

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Abstract

Electroless plating using dimethylamine-borane (DMAB) as a reducing agent showed poor selectivity of deposition on patterned surfaces formed using photoresist. In a basic study on selectivity, we studied the effect of complexing agent on micro-pattern formation using electroless NiB plating. Changing species and concentrations of complexing agents changed the formation of film deposition. We fabricated micro-pattern formation using electroless plating by selecting complexing agents. The combination of glycine and ammonium sulfate was found to be optimal to obtaining deposition with a smooth surface without voids only onto the catalyzed surface. It is thought that selectivity relates to stability of metal complexes rather than deposition rate and/or mixed potential. We found that the high stability of complexing agent yielded high selectivity.

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