Additive Effects on the Etching of Copper using Sulfuric Acid / Hydrogen Peroxide Solution
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- SEKISHITA Asuka
- National Institute of Technology, Hachinohe College
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- KIMURA Moe
- National Institute of Technology, Hachinohe College
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- TAKAYA Natsumi
- National Institute of Technology, Hachinohe College
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- KUBOTA Kenji
- Mitsubishi Matherials Corpration
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- MATSUMOTO Katsutoshi
- National Institute of Technology, Hachinohe College
Bibliographic Information
- Other Title
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- 硫酸/過酸化水素水溶液による銅のエッチングに対する添加剤の効果
- リュウサン/カサンカスイソ スイヨウエキ ニ ヨル ドウ ノ エッチング ニ タイスル テンカザイ ノ コウカ
Search this article
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 67 (1), 51-53, 2016
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204116545920
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- NII Article ID
- 130005187590
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- NII Book ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 027051958
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
