Improvement in Adhesion of Cu/glass Stacks using ZnO Thin Films Deposited by Chemical Solution Methods and Its Formation Conditions

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  • 塗布法によって堆積したZnO薄膜を用いたCu/ガラス構造の密着性向上ならびにその形成条件の検討
  • トフホウ ニ ヨッテ タイセキ シタ ZnO ハクマク オ モチイタ Cu/ガラス コウゾウ ノ ミッチャク セイコウ ジョウ ナラビニ ソノ ケイセイ ジョウケン ノ ケントウ

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Abstract

After zinc oxide (ZnO) thin films were deposited using chemical solution methods such as sol-gel method and metal organic decomposition, the deposited ZnO thin films were used as a precursor promoting adhesion in Cu/glass stack systems. Transparent ZnO thin films were deposited on a borosilicate glass substrate using chemical solution methods. X-ray diffraction and X-ray photoelectron spectroscopy analyses revealed that the deposited ZnO thin films have no specified orientation and much less carbon contamination. The obtained ZnO thin films comprised two characteristic layers: a porous structure formed at the glass substrate side and a dense layer formed at the surface side. The adhesion of Cu/glass stacks formed by the ZnO thin films increased markedly when the ZnO/glass stacks were annealed at 600 ℃. Furthermore, the adhesion increased with increasing ZnO removal time, reaching a maximum value at a certain removal time, but decreasing thereafter. These results indicate that the deposited ZnO thin films are effective for the improvement of Cu/glass stack adhesion. Results show that a Zn-doped layer formed at the glass surface plays an important role in the improvement of Cu/glass stack adhesion.

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