Wettability of Lead-Free Solders on Gold-Plated Copper Substrates

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  • Duong Ngoc Binh
    School of Materials and Minerals Resources Engineering, University Sains Malaysia
  • Ariga Tadashi
    Department of Materials Science, School of Engineering, Tokai University
  • Hussain Luay Bakir
    School of Materials and Minerals Resources Engineering, University Sains Malaysia
  • Ismail Amad Badri
    School of Materials and Minerals Resources Engineering, University Sains Malaysia

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説明

Wettability of lead-free solders (Sn-3Ag-0.5Cu, Sn-8Zn-3Bi, and Sn-9Zn) on Au-plated copper substrate was investigated with three different thicknesses of Au layer (0.1 μm, 0.3 μm, and 0.5 μm). The contact angles of solder alloys did not show a dependence on Au thickness. The contact angles of Sn-3Ag-0.5Cu and Sn-9Zn decreased, whereas the contact angle of Sn-8Zn-3Bi remained constant with an increase in temperature. Wetting balance test results indicated that thickness of Au plating affects wetting force, with thinner plating showing stronger wetting force and therefore, lower wetting time. Effects of different fluxes on wettability were also studied.

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