Bonding technique using micro-scaled silver-oxide particles for In-situ formation of silver nanoparticles
-
- Morita Toshiaki
- Materials Research Laboratory, Hitachi Ltd.
-
- Yasuda Yusuke
- Materials Research Laboratory, Hitachi Ltd.
-
- Ide Eiichi
- Materials Research Laboratory, Hitachi Ltd.
-
- Akada Yusuke
- Division of Materials and Manufacturing Science, Osaka University
-
- Hirose Akio
- Division of Materials and Manufacturing Science, Osaka University
書誌事項
- タイトル別名
-
- Bonding Technique Using Micro-Scaled Silver-Oxide Particles for <I>In-Situ</I> Formation of Silver Nanoparticles
この論文をさがす
抄録
We investigated a new bonding technique utilizing micro-scaled silver-oxide (Ag2O) particles. The results of our investigations revealed that bonding between electrodes using for semiconductor modules can be accomplished by adding myristyl alcohol to silver-oxide particles, followed by heating the mixture in air at 300°C under a pressure of 2.5 MPa. Since this bonding technique produces silver particles with a size of a few nanometers when the silver oxide is reduced by the presence of the alcohol, low-temperature sintering and bonding can be achieved.
収録刊行物
-
- MATERIALS TRANSACTIONS
-
MATERIALS TRANSACTIONS 49 (12), 2875-2880, 2008
公益社団法人 日本金属学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390001204250969728
-
- NII論文ID
- 10024404218
- 130004453901
-
- NII書誌ID
- AA1151294X
-
- COI
- 1:CAS:528:DC%2BD1MXhvVyns70%3D
-
- ISSN
- 13475320
- 13459678
-
- NDL書誌ID
- 9728898
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可
