Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

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  • Miyajima Yoji
    Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Uchiyama Midori
    Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Adachi Hiroki
    Department of Materials and Synchrotron Radiation Engineering, Graduate School of Engineering, University of Hyogo
  • Fujii Toshiyuki
    Department of Metallurgy and Ceramics Science, Tokyo Institute of Technology
  • Onaka Susumu
    Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Kato Masaharu
    Department of Materials Science and Engineering, Tokyo Institute of Technology

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<p>The microstructure and texture evolution of an accumulative roll bonding (ARB) processed 4N-Cu with and without lubrication were compared in addition to the mechanical properties, in order to understand the effect of additional shear strain caused by the friction between the rolls and a sheet. Furthermore, subsequent annealing at 423 K, 448 K and 473 K was applied for 4N-Cu ARB processed with and without lubrication, and, softening was observed for all temperatures. The texture change due to the ARB process and subsequent annealing were discussed using {111} pole figures and ODF maps. As a result, a 45° rotated Cube texture around ND was formed by additional shear strain, whereas the typical fcc rolling texture was formed by ARB with lubrication. At higher ARB cycles of 4N-Cu, discontinuous recrystallization occurs due to its medium stacking fault energy. Cube orientation appeared in annealed-ARB processed 4N-Cu with lubrication, whereas no specific texture appeared in annealed-ARB processed 4N-Cu without lubrication</p>

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