Friction and Abrasion Durability of Polymer Thin Films Sputtered with a Polyimide Target and Adhesion Property to Copper Substrate (Nitrogen Gas Effect)

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  • ターゲットにポリイミドを用いて作製したスパッタ高分子薄膜の摩擦・摩耗特性と銅基板との密着性（窒素ガスの効果）
  • ターゲット ニ ポリイミド オ モチイテ サクセイ シタ スパッタ コウブンシ ハクマク ノ マサツ マモウ トクセイ ト ドウ キバン ト ノ ミッチャクセイ チッソ ガス ノ コウカ

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Abstract

Polymer thin films were sputtered onto copper substrate with a polyimide target. Argon and nitrogen were introduced into the sputtering chamber for the sputtering gases. Although sputtering rate of the polymer thin film with argon gas showed highest value at a pressure of 5mTorr. On the contrary, the sputtering rate of the polymer thin film with nitrogen gas showed highest value at a pressure of 60mTorr. Nitrogen content in the thin film sputtered with the nitrogen gas (N2 sputtered thin film) increased compared to that sputtered with argon gas (Ar sputtered thin film) and target material. Frictioncoefficient and abrasion durability of the N2 sputtered thin film were higher than those of the Ar sputtered thin film. The pull strength between the N2 sputtered thin film and copper substrate was higher than that between the Ar sputtered thin film and copper substrate. In addition, the N2 sputtered thin film was introduced between the copper substrate and Ar sputtered thin film (Ar/N2/Cu laminate). The pull strength of this laminate showed higher value than that between the Ar sputtered thin film and copper substrate.

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