Effects of Corrosive Gases on Corrosion & Adhesion Properties of Conductive Pastes

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  • 導電ペーストのコロージョンおよび接着特性に及ぼす腐食性ガスの影響
  • Effects of Corrosive Gases on Corrosion ^|^amp; Adhesion Properties of Conductive Pastes

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Abstract

We have investigated the effects of corrosive gases on corrosion and adhesion properties of the conductive pastes used for electronic device interconnection wires and electrodes. We examined three different polymer-type conductive pastes. All three pastes contain silver particles as their conductive filler. In one of the pastes, polyester is used as the binder; in another, silicone; and in the third, epoxy resin. We applied each conductive paste to a flexible bilayer polyimide printed-circuit board and then let them cured. We then subjected the cured conductive pastes to an acceleration test, placing the board in a tank filled with a mixture of corrosive gases. The test conditions we set up were equivalent to exposing a sample of silver to a typical Southeast Asian environment for five years, as follows: 2 ppm hydrogen sulfide gas, 4 ppm nitrogen dioxide gas, a temperature of 30℃, a relative humidity of 70%, and testing duration of 77.3 hours. To analyze the resulting corrosion, we cut samples, using the SAICAS slant-cut method, and checked the sulfur component in the cut section of each sample by using both the scanning electron microscope and the EDX component analysis method. We found that, for each of the pastes, the corrosion reached a depth of about 2μm, as expected. We also measured the adhesion properties of each conductive paste, using the SAICAS method. As a result, we haveconfirmed that the conductive paste which contains epoxy resin as its binder has a higher adhesion with respect to horizontal peeling than the other types, and that its adhesion does not deteriorate, even after the corrosion test.

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