Novel Pressure-sensitive Bonding Tape in the Three-dimensional Chip Stacking

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  • 3次元半導体実装への新規粘接着テープ
  • 3ジゲン ハンドウタイ ジッソウ エ ノ シンキネンセッチャク テープ

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Abstract

The current epoxy resin-based paste bonding adhesives have some problems in fabricating stacked integrated circuits. In an attempt to solve the problems and to simplify the fabricating procedure, the novel dual-curable pressure-sensitive bonding tape consisting of UV-curable pressure sensitive adhesive (PSA) and thermally curable epoxy resin was investigated. An UV-curable PSA was composed of an acrylic copolymer and UV-curable resin. Excess addition of UV-curable resin and exposure of UV light resulted in poor adhesion. There are two major factors for better compatibility and suitable properties. One is the incorporation of glycidylmethacrylate into the copolymer, and the other is addition of a novolak type epoxy resin. It was ascertained that the newly developed pressure-sensitive bonding tape possesses the performances both of the commercially available dicing tape and the epoxy paste-bonding agent.

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