Preparation of photo-curing acrylate thin films containing Pd nanoparticles and their application for e1ectroless plating catalysts
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- Hamada Takashi
- Innovation Plaza Osaka, Japan Science and Technology Agency
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- Watase Seiji
- Department of Electronic Materials, Osaka Municipal Technical Research Institute
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- Matsuura Yukihito
- Department of Electronic Materials, Osaka Municipal Technical Research Institute
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- Kondo Hiroshi
- Osaka electro-Communication University
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- Nishioka Noboru
- Osaka electro-Communication University
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- Matsukawa Kumihiro
- Department of Electronic Materials, Osaka Municipal Technical Research Institute
書誌事項
- タイトル別名
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- Preparation of Photo-curing Acrylate Thin Films containing Pd Nanoparticles and their Application for Electroless Plating Catalysts
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A novel strategy to fabricate the copper pattem by electroless copper plating was investigated. The photolithographic negative pattems were fabricated by the hybrid f11ms with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis flne patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin fllms enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin f11m and deposited copper.
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 20 (1), 137-140, 2007
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詳細情報 詳細情報について
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- CRID
- 1390001204324073600
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- NII論文ID
- 130004833180
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- NII書誌ID
- AA11576862
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- COI
- 1:CAS:528:DC%2BD2sXot1Wnt70%3D
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- ISSN
- 13496336
- 09149244
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- NDL書誌ID
- 8918572
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可