Transfer Printing of Au Micropatterns on Polyimide Films

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  • Komori Takayuki
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Kosuge Tatsuya
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Kuroda Keigo
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Saito Hirofumi
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Kimura Yohta
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Fukushi Yudai
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Maenosono Hirotaka
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Koide Shohei
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Satano Masahiro
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Ikoma Ryuta
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University
  • Nishioka Yasushiro
    Department of Precision Machinery Engineering, College of Science and Technology, Nihon University

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The transfer printing of Au micropatterns onto a polyimide (PI) film was investigated, and the optimum transfer conditions were obtained. In this study, micropatterns with widths of 25 μm and 75 μm were successfully transferred onto a PI film at a molding temperature of 150 °C for 5 s under a molding pressure of 2.5 MPa. This technique is expected to provide simplified processes in fabricating wiring patterns in microelectromechanical systems.

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