Analysis of Diffusion and Deposition Process of Flowing Metal Ions in Micro-plating Method

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  • Nakashima Seisuke
    Department of Solid State Materials and Engineering, Graduate School of Engineering, Yokohama National University RIKEN - Advanced Research Institute
  • Tanaka Jun
    RIKEN - Advanced Research Institute
  • Munekata Rikiya
    Department of Solid State Materials and Engineering, Graduate School of Engineering, Yokohama National University
  • Mutaguchi Hiroaki
    Department of Solid State Materials and Engineering, Graduate School of Engineering, Yokohama National University
  • Mukai Kohki
    Department of Solid State Materials and Engineering, Graduate School of Engineering, Yokohama National University

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We have investigated diffusion and deposition process of flowing Ni ions in our original micro-plating method, in which an electroless plating solution of Ni is continuously flowed into negative-type micromolds. The negative-type molds, which are made of photocurable resin, have hollow template structures. Experiments of Ni plating were carried out using one microchip containing micromolds of varied diameters. Dependences of Ni-plate thickness on micromold size were evaluated using optical micrographs, indicating that the plating efficiency was increased as the decrease in the diameter. The change of plating behavior was analyzed using a numerical simulation considering diffusion theory and Hagen-Poiseuille low. The time evolution of Ni-plate thickness was calculated from the distribution of the Ni ion concentration in the mesh neighboring the wall surface of micromolds. This simulation successfully reproduced the tendency of experimental results. It was found that the plating efficiency was strongly dependent on the flow velocity in the region near the wall surface of micromolds.

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