Synthesis of Heat Curable Soluble Polyimides Utilizing Pendant Phenylethynyl Group
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- Takahashi Kazuya
- Department of Environmental and Life Sciences, Toyohashi University of Technology
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- Takahashi Shotaro
- Department of Environmental and Life Sciences, Toyohashi University of Technology
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- Itatani Hiroshi
- Solpit Industrial Co., Ltd.
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- Takeichi Tsutomu
- Department of Environmental and Life Sciences, Toyohashi University of Technology
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抄録
A diamine, 2,4-diaminophenylethynylbenzene (DAPEB), that have pendant phenylethynyl group, was synthesized. Utilizing DAPEB as one component, a novel soluble polyimide (PI), Solpit-T, that can be thermally cured was synthesized. Solpit-T is soluble prior to curing, but became insoluble in organic solvents after curing, showing improvement in chemical resistance. In addition, cured Solpit-T films revealed large elongation at break; 8% and 39% at 33 mol% and 8 mol% DAPEB in total diamine, respectively, showing that cured Solpit-T has outstanding toughness for thermosetting PI. Cured Solpit-T films have Tg s as high as above 400 °C from the DMA measurement, which is the same as the Solpit-S and PI(PMDA/ODA). Thermogravimetric analyses revealed that 5 % weight loss temperatures were higher than 450 °C.
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 27 (2), 146-150, 2014
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詳細情報 詳細情報について
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- CRID
- 1390001204325640832
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- NII論文ID
- 130004678356
- 40020133019
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- NII書誌ID
- AA11576862
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- ISSN
- 13496336
- 09149244
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- NDL書誌ID
- 025604131
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可