Preparation of Nanopatterned Polyimide by Imprinting and Curing Phenylethynyl- terminated Imide Oligomer

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Abstract

Addition-type phenylethynyl-terminated imide oligomers were synthesized from 4,4’-diaminodiphenyl ether(ODA), 4-phenylethynylphthalic anhydride (PEPA) and 3,3’,4,4’-biphenyltetracarboxylic dianhydride (BPDA) or 4,4’-hexafluoroisopropylidene)- dianhydrid (6FDA), and preparation of nanopatterned polyimide was examined by imprinting the melted phenylethynyl-terminated imide oligomer and crosslinking the ethynyl groups. Crosslinked polyimide films were prepared by pressing the melted phenylethynyl-terminated imide oligomers and curing them under pressure at 370 °C afterward, and the properties of the polyimide films were studied for comparison. The crosslnked polyimide films had high glass transition temperature (Tg) above 320 °C, and showed excellent tensile strength more than 100 MPa. Nanopatterned polyimide was prepared by imprinting the melted imide oligomer with a metal mold and curing it under pressure at 370 °C afterward. ZEONOR(R) film could be imprinted using the imprinted and cured imide oligomer as sub-mold instead of the metal mold.

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