Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
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- Ishida Hiroyuki
- Bonder Division, SUSS MicroTec KK
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- Lutter Stefan
- Bonder Division, SUSS MicroTec Lithography GmbH, A SUSS MicroTec AG Company
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There can be two kinds of de-bonding options in the aspect of the releasing interface, one is carrier release and the other is device wafer release. Thermoplastic adhesives are used in most cases for carrier release because the materials can easily be cleaned by solvent. On the other hand, device wafer release is usually selected for thermoset adhesives, which is difficult to remove by solvent.
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 27 (2), 173-176, 2014
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詳細情報 詳細情報について
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- CRID
- 1390001204325850240
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- NII論文ID
- 130004678334
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- NII書誌ID
- AA11576862
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- ISSN
- 13496336
- 09149244
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- NDL書誌ID
- 025604149
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可