Low Temperature Curing of Polyimide Precursors by Variable Frequency Microwave

DOI Web Site Web Site 被引用文献7件 参考文献9件
  • Matsutani Hiroshi
    Research & Development Center, Hitachi Chemical Co. Ltd.
  • Hattori Takashi
    Research & Development Center, Hitachi Chemical Co. Ltd.
  • Ohe Masayuki
    Yamazaki Research & Development Center, Hitachi Chemical DuPont MicroSystems, Ltd.
  • Ueno Takumi
    Yamazaki Research & Development Center, Hitachi Chemical DuPont MicroSystems, Ltd.
  • Hubbard Robert L.
    Technology Development, Lambda Technologies, Inc.
  • Fathi Zak
    Technology Development, Lambda Technologies, Inc.

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Polyimides are commonly used as a thermally stable insulator for semiconductors. To assure adequate chemical or physical properties, a layer of their precursors has to be cured in a convection oven at more than 300 °C. In this paper, we compare variable frequency microwave (VFM) heating with convection heating for curing various polyimide precursors and a photosensitive polyimide precursor. Then, we demonstrate that the use of VFM enables us to cure the precursor lower than the standard convection cure temperature while maintaining necessary film properties such as cyclization, Tg, Td, and elongation.

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