Development and slicing performance of high accuracy multi-wire saw

DOI Web Site 7 References

Bibliographic Information

Other Title
  • 高精度マルチワイヤソーの開発とその加工性能
  • 高精度マルチワイヤソーの開発とその加工性能(第1報)テーブル真直度とフレーム熱変形が加工精度に及ぼす影響
  • コウセイド マルチワイヤ ソー ノ カイハツ ト ソノ カコウ セイノウ ダイ 1ポウ テーブル シンチョクド ト フレーム ネツ ヘンケイ ガ カコウ セイド ニ オヨボス エイキョウ
  • 第１報：テーブル真直度とフレーム熱変形が加工精度に及ぼす影響
  • 1<SUP>st</SUP> report: Effect of table feed straightness and thermal deformation of frame to cutting accuracy

Search this article

Abstract

Warp accuracy and nanotopography in the silicon wafer slicing process influence the final quality of the wafer. Therefore, methods to improve these factors are important. The present study was performed to assess mechanical factors, such as machine static accuracy and thermal deformation, to improve the accuracy of multi-wire saws. The results indicated that table feed accuracy is closely connected to warp accuracy. By enhancing the straightness of the table guides, we improved component deformation. Moreover, we clarified the frame's thermal deformation characteristics, and by employing low thermal expansion materials, we improved the thermal deformation characteristics.

Journal

References(7)*help

See more

Keywords

Details 詳細情報について

Report a problem

Back to top